The U.S. market for molecular, nanoscale, and atomic imaging is valued at $1.8 billion in 2007 and is expected to have a compound annual growth rate (CAGR) of 18.5%, reaching $4.2 billion in 2012. (read more)

The BioScope™ II atomic force microscope (AFM) has been engineered specifically to facilitate advanced bioscience research. Combining Optical and Atomic Force Microscopy. (read more)

The InSight^TM 3D Atomic Force Microscope (AFM) provides unparalleled accuracy and precision required for non-destructive, high-resolution 3D measurements of critical 45nm and 32nm semiconductor features. (read more)

PCB Express, Inc is cost effective for all your multi layer board needs, including two plants in Asia. They offer Internet pricing for prototypes, domestic and offshore production. They give you one point of contact and guaranteed quality. (read more)

Looking for the latest technology available for highly accurate bulk analysis as well as quantitative depth profiling for coatings analysis and surface treatments? (read more)

Palletiser/depalletiser Layer Master, an automation solution for depalletising and palletising unmixed layers (read more)

This 4 layer product aids in the protection of a variety of surfaces. When applied to glass, the film also offers the extra benefits blocking heat, glare, and 99 percent of damaging ultraviolet rays. Easy application with no or little residue and paints and permanent markings are easily removed without harsh chemicals. (read more)

Uses of AFM analysis in cross-section for multi-layer materials include failure analysis, process development, product evaluation, and formulation optimization... (read more)

DRC Metrigraphics use a combination of process tools, high-resolution photolithography, thin-film coating, and micro-miniature 2-D and 3-D precision electroforming are combined to produce high density, multi-layer flexible circuits with 5-micron traces and spaces. (read more)

A combination of high-resolution photolithography, thin-film coating, and precision electroforming are combined to produce high density, multi-layer flexible circuits with 5 micron traces and spaces. (read more)