Master Bond manufactures custom made UV and light cure adhesives. A recent custom formulation UV18Med, features a tensile strength >950 psi., superior chemical resistance and electrical insulation. UV18Med forms tough bonds, adheres to a wide range of substrates, has low shrinkage, has a service operating temperature range of -80°F to +250°F, cures in < 1 minute, and viscosity is 1,800-2,000 cps. (read more)

MB297FL is an "instant cure" cyanoacrylate adhesive. It has excellent bond strength to metals, plastics and elastomer. The adhesive features high impact strength, superior resistance to shock and vibration, and adheres to materials with different expansion coefficients. It has excellent optical clarity, good resistance to many chemicals and a wide service operating temperature. (read more)

Master Bond Supreme10HTFS is a, 2 minute, rapid curing and electrically conductive silver filled epoxy. It features tensile shear strengths of 1,200 psi, T-peel strengths in excess of 5 pli, and volume resistivity less than 10^-3 ohm-cm. Service temperatures are from 4°K up to 205°C with superior resistance to impact, thermal shock, vibration ,creep and corrosion. (read more)

Master Bond EP3HTMED is a fast curing medical adhesive designed to improve the assembly of disposable and reusable medical devices. High strength bonds are resistant to impact, vibration and stress fatigue cracking over a wide service temperature range of -60°F to 400°F. Master Bond's medical adhesive fully complies with USP Class Vl requirements for biocompatibility. (read more)

The new EC-5 Spot Curing system is the most economical unit available at 6 W/cm2 while offering the convenience of the smallest foot print in the market. (read more)

Master Bond's MasterSil773 is a silicone conformal coating designed to provide superb protection to electronic circuitry in high humidity environments and upon exposure to shock and vibration. It cures quickly at ambient temperatures to a flexible, transparent silicone coating. Low modulus is retained over a temperature range of -85°F to +390°F (read more)

ELC-4101 is a low viscosity, clear, adhesive for bonding all glass, metal and hard to bond plastic components with excellent adhesion. ELC-4101 cures rapidly, in 10 seconds or less, when exposed to ultraviolet light from medium pressure mercury or microwave lamps. (read more)

Valtech Corporation manufactures two component epoxy adhesives used in the semiconductor and photovoltaic industry for ingot slicing applications. (read more)

Valtech Corporation unveils a new line of heat release adhesive systems for temporary bonding applications. The AD4000 series of products were designed to allow temporary bonding in a requiring complete removal of the adhesive from the bonded materials.

Debonding require 90C (194F) heat and takes only 30-60 seconds and is complete leaving no adhesive residues on the bonded materials. (read more)

The complete line of Loctite® adhesives, sealants, lubricants, coatings, dispensing and curing equipment. (read more)