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Product Categories for ic packaging resin
Molding Compounds and Resins -
(219 companies)
Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding
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Electrical Resins and Electronic Compounds -
(311 companies)
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
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Casting Resins -
(163 companies)
Casting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place
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Specialty Polymers and Resins -
(373 companies)
Specialty polymers and resins are proprietary polymers, resins, monomers and intermediates. This category includes plastics and elastomers that are based on proprietary curing technologies or chemistries, or that are designed for specialized applications
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Resins and Compounds -
(1826 companies)
Resins and compounds are pellets, liquid resins, bulk molding compounds, or other unfinished materials that are ready for shape fabrication or bond formation
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Thermosets and Thermoset Materials -
(298 companies)
Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics
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Thermoplastics and Thermoplastic Materials -
(581 companies)
Thermoplastics and thermoplastic materials soften when heated and harden when cooled. They can withstand many heating and cooling cycles and are often suitable for recycling.
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Plastics and Plastic Materials -
(765 companies)
Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms
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Packaging Tapes and Films -
(653 companies)
Packaging tapes and films are used to seal or wrap boxes, bottles or other packages
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Encapsulants and Potting Compounds -
(174 companies)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
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Thermal Compounds and Thermal Interface Materials -
(116 companies)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Laminating Adhesives and Composite Resins -
(109 companies)
Laminating adhesives and composite resins are cured using heat and/or heat and pressure
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Conductive Adhesives and Compounds -
(114 companies)
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
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Plastic Molding Services -
(2264 companies)
Plastic molding services use a number of different molding techniques to produce components, including thermoplastic and thermoset injection molding, blow molding, rotational molding, thermoforming, structural foam molding, compression molding, resin transfer molding (RTM), and others.
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Industrial Adhesives -
(1021 companies)
Industrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types.
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Product Announcements for ic packaging resin
Product Announcements: 1 - 10 of 5173
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Ironwood Electronics, Inc.
Package Converters
Ironwood Electronics, Inc. offers over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. They also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are their speciality
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Browse IC Sockets and Interconnect Components Datasheets for Ironwood Electronics, Inc.
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Mitsui Chemicals America, Inc.
ADMER® Adhesive Resin
An adhesive resin, ADMER® is used in multilayer packaging
systems in the food industry and in plastic fuel tanks (PFT), fuel lines, fuel
filler pipes, and connectors in the automotive industry. It is also used in
industrial and medical applications.
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Solvay Advanced Polymers, LLC
Torlon® polyamide-imide resin
TORLON polyamide-imide offers the advantages of a thermoset, in that once cured, it provides unstoppable performance in some of the most severe service environments. But like a thermoplastic, it can be processed by standard methods such as injection molding, extrusion and compression molding.
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Ironwood Electronics, Inc.
Custom IC Package Converters and Adapters
Ironwood Electronics, Inc. manufactures custom IC package converters and adapters to match your specifications.
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Browse IC Package Converters and Adapters Datasheets for Ironwood Electronics, Inc.
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iC-Haus Corporation
iC-ML Hall Position Sensor/Encoder
The iC-ML supplies the absolute linear position of a magnetic tape placed above the chip's package, with a Hall sensor array granting a reasonable system assembly tolerance. Controlled signal amplitudes are ensured by the embedded signal conditioning circuit also monitoring a "loss of magnetic field" condition.
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Mouser Electronics, Inc.
Avago Tech's Miniature Signal Conditioning IC
Mouser Electronics, Inc., known for its rapid introduction of the newest products, today announced it is now stocking the APDS-9700 miniature single-chip signal conditioning IC from Avago Technologies, a leading supplier of analog interface components for communications, industrial, and consumer applications.
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Servoflo Corporation
New, Optimized Sensor Signal Conditioning IC
Servoflo Corporation is pleased to announce a new sensor signal conditioning IC from ZMD. As part of the RBic-Lite™ signal conditioning family of IC's, the ZMD31014 is optimized for microcontroller-based sensor systems. Developed for correction of resistive bridge sensors, the ZMD31014 combines high accuracy amplification with analog-to-digital conversion of a differential input.
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Browse Signal Conditioners Datasheets for Servoflo Corporation
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Mitsui Chemicals America, Inc.
BN300 Substrate for IC
BN300 Substrate for IC has high performance due
to low warpage and high heat resistance due to high flexural modulus, low CTE
and high Tg (300).
(read more)
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Semtech Corp.
World's Smallest Dual-Input Battery Charger IC
The new Semtech SC820 battery charger IC offers class-leading features for charging portable devices via adapter and USB. It's ideal for applications that require 30V protection and OVP in a limited space.
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Browse Battery Chargers IC Datasheets for Semtech Corp.
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iC-Haus Corporation
iC-MZ: Differential Hall switch
The iC-MZ is an integrated device consisting of a differential Hall switch with back-end complementary line drivers.
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Tools & Useful Links for ic packaging resin
Tools & Useful Links: 1 - 1 of 1
Engineering Web: ic packaging resin
1 - 10 of 62,142
Innovations in IC Packaging Adhesives
This technology may have utility in wafer-level and other IC packaging applications where paste and film adhesives are traditionally employed. *Trademarks and brand names shown may be the property of ...
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Solid type cavity fill and under fill materials for new IC packaging ...
The base resin systems are selected by moisture performance and fluidity characteristics.. Keywords: solid type cavity fill under fill materials IC packaging applications encapsulating material flip ...
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Clean Tablet; innovation on the IC packaging material and process
... In the field of the IC packaging, almost every device assembled in the molding process with a thermosetting resin formed into a tablet. The trend for down sizing and integration of the IC devices ...
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Advanced IC packaging: Markets and trends
... but are still small compared to the total IC volume of 86 billion units.For more information on the fourth edition of the report, Advanced IC Packaging Markets and Trends, contact Electronic Trend ...
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A new liquid encapsulant for IC packaging
Keywords: package level reliability liquid encapsulant IC packaging SYCAR resin low moisture absorption high glass transition temperature dispensability long shelf life. Journal articles provided by: ...
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Materials and Methods for IC Package Assemblies
... IC packaging, to the point that the IC package has achieved a measure of parity in terms of importance with the IC itself. This is because, in many cases, the performance of the IC is gated by the IC ...
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Integrated Circuit Packaging; IC's, COB, TLCC, MCM
Hybrid Packaging Packaging Glossary {Terms and Definitions for IC Packaging} IC Package Type Definitions {Surface Mount/Through Hole Device Package Types, Specifications} Packaging Acronyms:. COB: ...
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Three-dimensional modeling of wire sweep incorporating resin cure
Keywords: three-dimensional modeling wire sweep resin cure cavity filling transfer molding IC packaging composite segment functions spatial wirebond geometry flow-induced forces finite element ...
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UV Improvement Machine of an IC packaging
... by UV lamps at an exposure room prior to mold by a resin. Figure 1 shows a schematic diagram of the production flow of a 1st level packaging and the UV pre-treatment on a IC chip assembly to improve ...
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Low-stress encapsulation resin for VLSI
Keywords: thermal expansion coefficient polymer mixture IC packaging encapsulation resin VLSI low-stress molding compound soft-elastomer-domain epoxy-resin matrix structure physical properties domain ...
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