9001-E-v3.1 is a 100% solvent-free, glob top chip encapsulant, which cures in seconds on flexible and rigid printed circuits. (read more)

20‑3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat. (read more)

Ellsworth Adhesives is the world's largest distributor of encapsulants. Shop online for virtually every encapsulant used in industrial applications. (read more)

• RF 1158 and RF 1158AS is a filled, pourable epoxy resin which was formulated for potting, encapsulating or casting applications. The RF 1158AS formula is designed to resist filler settling.
• This material has very good machining qualities and can also be used to anchor bolts, tracks, and other materials to concrete and as a facing for metal cores.

Although Epoxies, Etc... offers a complete standard product line, we also custom formulate Potting and Encapsulating Compounds for specific customer requirements. (read more)

20-2620 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. (read more)

UV Cure 60-7107 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). This product has excellent dielectric properties, high chemical and thermal stability. This system is 100% solids and has the ability to shadow or heat cure. (read more)

We supply potting and encapsulating of small to medium sized parts for a wide range of applications, including the computer, medical equipment, military electronics and aerospace, and microelectronics industries. (read more)

Ellsworth Adhesives proudly carries Dow Corning Sylgard poly-dimethyl siloxane (PDMS) Encapsulants. They are used for a multitude of specialized tasks from protecting strain sensitive electronic components to creating soft lithography molds in the fabrication of new types of electronic, magnetic, and optical devices. (read more)

Vernexx, LLC can assist with your specific needs with the encapsulating of Oki Reed Switches at their facilities, ensuring that your order meet both your needs and deadlines. (read more)