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Product Categories for encapsulant
Encapsulants and Potting Compounds -
(176 companies)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
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Electrical Resins and Electronic Compounds -
(317 companies)
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
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Conductive Adhesives and Compounds -
(117 companies)
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
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Thermal Compounds and Thermal Interface Materials -
(118 companies)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Thermal Insulation and Fireproofing Materials -
(505 companies)
Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.
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Electrical Insulation and Dielectric Materials -
(182 companies)
Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.
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Conformal Coatings -
(96 companies)
Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
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Dielectric Ceramics and Substrates -
(128 companies)
Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.
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Grommets -
(204 companies)
Grommets are eyelets that are used to strengthen or protect an opening, or to insulate and protect an object passing through an opening. They are made from metal, plastic, or rubber materials and are usually round, oval, oblong, square or rectangular.
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Hot Melt Adhesives -
(158 companies)
Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly.
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Gas Chromatographs -
(100 companies)
Gas chromatographs separate organic chemical mixtures according to physical properties.
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EMI and RFI Shielding -
(291 companies)
EMI and RFI shielding includes coatings, gaskets, enclosures, sealants, resins and other products or materials that block out electromagnetic interference (EMI) and radio frequency (RF) interference.
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Process Dryers -
(430 companies)
Process dryers are used to remove liquids or moisture from bulk solids, powders, parts, continuous sheets or other liquids by evaporation or sublimation.
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Industrial Adhesives -
(1021 companies)
Industrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types.
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Casting Resins -
(164 companies)
Casting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place.
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Product Announcements for encapsulant
Product Announcements: 1 - 10 of 49
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DYMAX Corporation
DYMAX 9001-E-v3.1 Chip Encapsulant
9001-E-v3.1 is a 100% solvent-free, glob top chip encapsulant, which cures in seconds on flexible and rigid printed circuits.
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Ellsworth Adhesives
Encapsulants
Ellsworth Adhesives is the world's largest distributor of encapsulants. Shop online for virtually every encapsulant used in industrial applications.
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Epoxies Etc...
UV Curable Low CTE Encapsulant
UV Cure 60-7107 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). This product has excellent dielectric properties, high chemical and thermal stability. This system is 100% solids and has the ability to shadow or heat cure.
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Ellsworth Adhesives
Dow Corning Sylgard Encapsulants
Ellsworth Adhesives proudly carries Dow Corning Sylgard poly-dimethyl siloxane (PDMS) Encapsulants. They are used for a multitude of specialized tasks from protecting strain sensitive electronic components to creating soft lithography molds in the fabrication of new types of electronic, magnetic, and optical devices.
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Epoxies Etc...
Custom Encapsulants and Potting Compounds
Although Epoxies, Etc... offers a complete standard product line, we also custom formulate Potting and Encapsulating Compounds for specific customer requirements.
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E.V. Roberts
Adhesives, Electrical Encapsulants, Sealants...
Please contact E.V. Roberts for any purchase related questions.
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G.I.S., Inc.
FIBERGLASS LINER
Knauf Duct Liner E•M is a flexible, mat-faced insulation made from inorganic glass fibers bonded by a thermosetting resin with an encapsulant edge coating. It is faced with a tightly bonded mat to give the airstream a smooth, tough surface, resisting damage during installation and operation. The encapsulant edge coating eliminates airstream flaring.
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Ellsworth Adhesives
Technical Services
Application Engineers, Plant Audit and Engineer Survey, In-Plant Technical Seminars and Immediate Technical Support.
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International Transducer Corp.
Model ITC-4066 Omnidirectional Long-Life Receiver
The model ITC-4066 hydrophone has been known for over 15 years as one of the world's most reliable and durable sensors. The critical bond between the ceramic element and the polyethylene encapsulant, developed by ITC, made it possible to combine long life and superior acoustic performance.
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DYMAX Corporation
DYMAX 9-20557 Conformal Coating
9-20557 conformal coating forms a tough, clear circuit encapsulant upon exposure to longwave UV/visible light. It is excellent for encapsulating, potting, sealing and bonding.
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Other Topics You Might Be Interested In
Epoxy (EP) resins exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins...
( Read More)
Thermally conductive materials are an effective way to resolve a variety of design and processing challenges. They fall into the categories of adhesives, coatings, films, encapsulants, and greases.
( Read More)
Recommendations: The follow is recommended for storage and handling of frozen underfill encapsulant syringes. These recommendations should be used as guidelines in handling frozen underfill syringes...
( Read More)
Tools & Useful Links for encapsulant
Tools & Useful Links: 1 - 6 of 6
Engineering Web: encapsulant
1 - 10 of 20,951
Liquid Encapsulation Application Considerations
Liquid encapsulant should be limited to one hour of exposure prior to cure. If possible, the material should be gelled following the encapsulant dispense process, because gelled material is much less ...
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The back-end process: Step 5 - Encapsulation step by step
This is most likely explained by incomplete encapsulant gel before exposure to the high cure temperature. The portion of the encapsulant that was not already gelled reacted in a fast, uncontrolled ...
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Die Encapsulant Tutorial - Dow Corning
Die Encapsulant Tutorial. *Die Encapsulant Tutorial - Product Selection. *Die Encapsulant Tutorial - Product Quality. *Die Encapsulant Processing Tutorial. *Die Encapsulant Processing Tutorial - ...
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Die Encapsulant Applications - Dow Corning
... both an environmental barrier and a flexible interposer for added reliability.. Additional Information: Die Encapsulant Product Information. Die Encapsulant Tutorial. < back to Die Encapsulants Home ...
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Process Parameters for No-flow Underfills in Flip Chip Construction
The only way they can disappear is by dissolving in the liquid encapsulant, and bubbles have been observed to dissolve in a drop of encapsulant held between glass slides. This dissolution is helped by ...
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Chip encapsulant. (Product News).(Brief Article) Design News - Find Articles
. TRA-BOND 221UO1 is a highly filled, medium viscosity, electrically insulating epoxy encapsulant, intended for microelectronic chips. According to the company, stress effects .... Read the rest of this ...
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Encapsulant
Encapsulant. A substance. that. forms. a barrier. between. lead-based. paint and. the. environment. using. a liquid-applied coating. (with. or without. reinforcement. materials). or an adhesively ...
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Loctite® 3534 Glob Top Encapsulant
Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.. Loctite® 3534 Glob Top Encapsulant. A glob top encapsulant for transistors, smart cards ...
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Aptek 6103-A/B Epoxy Encapsulant
Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light.. Part A is deep red. Part B is clear to pale yellow.. Information ...
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Aptek 6109-A/B Epoxy Encapsulant
Optoelectronic grade flexible water clear encapsulant. Higher viscosity/lower Tg version for clear blob-top encapsulation of ceramic substrate devices. Part A is blue. Part B is clear to pale yellow.. ...
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