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Product Categories for die bonding adhesive
Adhesive Tapes and Films -
(682 companies)
Adhesive tapes and films temporarily or permanently join materials together
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Conductive Adhesives and Compounds -
(114 companies)
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components
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Electrical Resins and Electronic Compounds -
(311 companies)
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
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Foam Bonding Tapes -
(40 companies)
Foam bonding tapes are specialized tapes designed for adhesive joining of foam materials
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Thermal Compounds and Thermal Interface Materials -
(116 companies)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Double Coated and Transfer Tapes -
(69 companies)
Double coated tapes are coated with adhesive on both sides of the backing or carrier. Transfer tapes consist of a thin adhesive film without a carrier or backing
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Encapsulants and Potting Compounds -
(174 companies)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
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Industrial Tape -
(602 companies)
Industrial tape is used for adhesive bonding, thread sealing, masking, packaging, wrapping, electrical insulation, ESD control and other specialized applications
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Foil Tapes -
(53 companies)
Foil tapes are constructed with a thin metal-foil backing that provides a malleable, conductive and non-porous product for vapor sealing, shielding and ducting-leak repairs.
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Specialty Tapes and Films -
(145 companies)
Specialty tapes and films use proprietary or patented technologies and constructions, and are designed for specific industries and specialized applications.
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Electrical Insulation and Dielectric Materials -
(180 companies)
Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.
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Packaging Tapes and Films -
(653 companies)
Packaging tapes and films are used to seal or wrap boxes, bottles or other packages.
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Safety and Reflective Tapes -
(49 companies)
Safety and reflective tapes are highly visible in order to warn personnel of hazards or construction conditions.
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Metal Wire and Strand -
(165 companies)
Metal wire and strand has a round, flat, or shaped cross section. Products are usually less than 0.375" in diameter.
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Dielectric Ceramics and Substrates -
(126 companies)
Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.
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Product Announcements for die bonding adhesive
Product Announcements: 1 - 10 of 2503
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DYMAX Corporation
DYMAX 201-CTH Catheter Bonding Adhesive
Eliminate bond line stresses with USP Class VI approved 201-CTH light curing adhesive that bonds in seconds upon exposure to UV/visible light.
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DYMAX Corporation
DYMAX 203A-CTH Catheter Bonding Adhesive
Catheter/guidewire adhesive has secondary heat cure capability for shadowed areas. 203A-CTH, cures upon exposure to UV light and heat.
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DYMAX Corporation
DYMAX 3094 Plastic Bonding Adhesive
3094 plastic adhesive forms high strength bonds to acrylic, ABS, styrene, polycarbonate and polyurethane in seconds, when exposed to UV/visible light. It dispenses easily and cures quickly for precise quantity and placement of adhesive.
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DYMAX Corporation
DYMAX 1180-M Needle Bonding Adhesive
DYMAX MD® 1180-M adhesive is designed for rapid bonding of transparent or translucent acrylic, polycarbonate, PVC alloys, ABS, polyurethane, and polystyrene, as well as metal substrates. Solvent-free, low viscosity 1180-M dispenses easily and cures in seconds with UV/visible light, for precise quantity and placement of adhesive.
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DYMAX Corporation
DYMAX 206-CTH Catheter Bonding Adhesive
Solvent-free, low viscosity 206-CTH dispenses easily and cures quickly for precise quantity and placement of adhesive. Bonding balloon to shaft, needle to hub; potting It is designed for rapid bonding of transparent or translucent acrylic, polycarbonate, PVC alloys, ABS Nylon, PU, PEBAX®,, polyurethane, and polystyrene, as well as metal substrates.
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DYMAX Corporation
DYMAX 1193-M-VLV Needle Bonding Adhesive
USP Class VI and ISO 10993 Certified DYMAX MD® 1193-M-VLV is a fast curing, low viscosity, adhesive that forms high strength bonds in seconds. Flexible and resilient, 1193-M-VLV adheres rapidly to transparent or translucent acrylic, and bonds stainless steel cannula to polycarbonate, PVC and polypropylene hubs.
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DYMAX Corporation
DYMAX 3069 Plastic Bonding Adhesive
3069 plastic adhesive is ideal for electrical bonding, potting, and wire harness assembly.
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DYMAX Corporation
DYMAX 204-CTH Catheter Bonding Adhesive
Resilient catheter resin cures in seconds to form high strength bonds to flexible and rigid substrates, and even cures through UV blocking plastics.
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Tailored Label Products, Inc.
Custom Die Cut Adhesives
Precision die cut adhesives tailored to your application for automated assembly.
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Schreiner ProTech North America, Inc.
Double-Sided Adhesive Die-Cut Parts (DSAP)
Schreiner Double-Sided Adhesive Die-Cut Parts (DSAP): Efficient Assembly of Components
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Other Topics You Might Be Interested In
Traditionally, the most common types of die attach materials used in the semiconductor industry have been solder or adhesive. Both have been applied to the substrate, immediately before die attach.
( Read More)
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back...
( Read More)
The dominant trend in packaging DDR DRAM for the future is the face down substrate-on-chip configuration. For this type of package it is critical that the die attach method employed provide precise...
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Thin plastic packages, such as TQFPs, are more sensitive to stress and warpage. As a result, warpage in TQFPs may lead to severe delamination or die cracking. The assembly process and the choice of...
( Read More)
Tools & Useful Links for die bonding adhesive
Tools & Useful Links: 1 - 6 of 6
Engineering Web: die bonding adhesive
1 - 10 of 928,427
Hitachi Chemical Co., Ltd. : Die Bonding Paste EPINAL
Die Bonding Paste <EPINAL>. for Lead Frame. Inquiry. "EPINAL" has been used as a die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste. *for Substrate. ...
See Hitachi Chemical Co., Ltd. Information
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Adhesive Requirements for Void-Free Snap Cure Die Bonding
Adhesive Requirements for Void-Free Snap Cure Die Bonding. onto Polymer Substrates Saturated with Moisture. Carl E. Hoge. Dexter Corporation. 9938 Via Pasar. San Diego, CA, 92131. Phone: 619-695-1716 ...
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Die bonding with polyimide tape
Tokyo. S. Behler, "The Formation of Decompression Bubbles in Polyimide Adhesive Tapes," Proc. 49th ECTC (1999), p. 727. S. Behler, "Understanding Heat Transfer In The Lead-on-chip Die Bonding Process ...
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A shear based optimization of adhesive thickness for die bonding
... computations appear to support the assumption that elevated shear stress is the most likely cause of die-bond structural failure.. Keywords: shear based optimization adhesive thickness die bonding low-cost ...
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Innovations in IC Packaging Adhesives
... this adhesive technology would offer similar advantages for die-bonding applications. An industry leader in IC packaging recently demonstrated the feasibility of using the adhesive for die attach on ...
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[No Title]
... die-bonding film comprising a supporting substrate and a die-bonding adhesive layer formed on or over the supporting substrate, a mark for recognizing the position of the die-bonding adhesive layer ...
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On-bonder curing improves packaging productivity
... attach adhesive onto the substrate, placing the die and curing the die attach adhesive can be combined in a continuous process self-contained within the die bonder unit without the loss of die bonding ...
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Film adhesive and semiconductor package using the same invention
In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.. Patent Agent: ...
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Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]
HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent ...
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Adhesive film composition for semiconductor assembly, associated dicing die ...
... die bonding film, removing the semiconductor device from the dicing die bonding film by separating an adhesive film from the dicing die bonding film, such that the adhesive film remains attached to ...
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