Numerical Aperature (N.A.) of 0.39 and hard polymer cladding that allows a high core-to-clad ratio, the Superguide™ SPCH is the low cost fiber of choice. The pure fused silica (SiO2) used in the core of the Superguide™ fiber is made by reacting silicon tetrachloride (SiCl4) with oxygen (O2) using an oxy-hydrogen flame resulting in superior ultraviolet (UV) to visible (VIS) (read more)

Free up PCB real estate and reduce overall impedance of the power distribution system with FARADFLEX®, Oak- Mitsui's revolutionary ultra thin polymer film substrate capacitor plane for PCB fabrication. Oak-Mitsui's licensed Buried Capacitance™ technology eliminates the need for some discrete capacitors. (read more)

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electro-deposited Copper Foils for the printed circuit board industry. As the only U.S. manufacturer (but with the strength of international scope), Oak-Mitsui produces both conventional cladding and application specific Copper Foils required by technology's leading edge companies. (read more)

With high-density, high-speed applications in mind, Molex Incorporated and Neoconix have partnered to deliver a flexible, copper-based, high-density and speed (HD&S) interposer. The low-profile contact interface integrates Molex Copper Flex with Neoconix's HD&S PC Beam* interposer for flex-to-PCBA applications. Ideal for telecommunication, server, mass storage, medical imaging, automati... (read more)

For ferrous metals like low carbon steel and stainless, we offer a variety of options including preforms and paste. Our alloy options range from high purity, oxygen-free copper to alloys formulated for specific situations. (read more)

BN300 Substrate for IC has high performance due to low warpage and high heat resistance due to high flexural modulus, low CTE and high Tg (300). (read more)

Numerical Aperature (N.A.) of 0.39 and hard polymer cladding that allows a high core-to-clad ratio, the Anhydroguide™ APCH is the low cost fiber of choice. The pure fused silica (SiO2) used in the core of Anhydroguide™ fiber is made by reacting silicon tetrachloride (SiCl4) with oxygen (O2) using a plasma arc rather than an oxy-hydrogen flame. This ensures that the residual ... (read more)

When looking for a low cost fiber with a high numerical aperture (N.A.) for more efficient light coupling, the Anhydroguide™ PCS is the fiber of choice. With an N.A. of 0.37 and a plastic cladding that allows a high core-to-clad ratio, satisfies those requirements and more. The pure fused silica (SiO2) used in the core of the Anhydroguide™ fiber is made by reacting silicon tetra (read more)

From standard technology to the complex, high-density circuits that incorporate the latest manufacturing and product technology, STACI can meet all your Printed Circuit Board needs. This includes prototype, quick turn, and production volumes. (read more)

Panels Act As Rain Screen Reducing Substrate Moisture

Moisture build-up, rotting interior walls and mold growth can now be significantly reduced when using Nichiha fiber cement brick, stone and block panels. (read more)